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Mobile SoC ladder

MediaTekMobile SoC

Dimensity 1200

Spec snapshot for Dimensity 1200.

Best ladder rank
#34
Series
MediaTek
Release
2021-01-20

Ladder positions

1 placements
#34 MediaTek

Specifications

1 variants
Model Process Architecture Clock Speed GPU Memory Baseband Release Date Devices
Dimensity 1200 6 nm (TSMC N6) 1× Cortex-A78 + 3× Cortex-A78 + 4× Cortex-A55 3.0 + 2.6 + 2.0 GHz Mali-G77 MC9 up to 16GB Quad-channel LPDDR4x, supports Dual-channel UFS 3.1 storage Integrated MediaTek Helio M70 5G modem 2021-01-20 Redmi Note 10 Pro, realme GT Neo, OPPO K9 Pro
Architecture
CPU core layout, fastest cluster first
Clock Speed
Maximum clock of each cluster, in the same order
Baseband
Cellular modem and capabilities
GPU
Integrated graphics

Sources

2 references

Specifications are cross-checked against these references; conflicting values were reviewed before being corrected.