MEDIATEK · Mobile SoC
Dimensity 1200
Spec snapshot for Dimensity 1200.
Ladder positions
1 placements #34 MediaTek
Specifications
1 variants| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 1200 | TSMC 6nm EUVprocess | 1x A78+3x A78+4x A55 | 3.0+2.6+2.0GHz | ARM Mali-G77 MC9 | up to 16GB Quad-channel LPDDR4x, supports Dual-channel UFS 3.1 storage | Integrated MediaTek Helio M70 5G modem | 2021-01-20 | Redmi Note 10 Pro, realme GT Neo, OPPO K9 Pro |
- Architecture
- CPU Architecture / Core design
- Clock Speed
- Base or boost processor frequency
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics / Adreno / Mali