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MEDIATEK Mobile CPU
Dimensity 700
Spec snapshot for Dimensity 700.
Ladder positions
#45 in MediaTek
Specifications
| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 700 | 7nm | 2x A76 + 6x A55 | 2.2 + 2.0GHz | Mali-G57 MC2 950MHz | LPDDR4X-2133 12GB | 5G 2.77Gbps | 2020 Q4 | realme V11/V13/Q3i, Redmi Note 10/Redmi 11 Prime 5G, Honor X20 SE, Honor 畅玩30 Plus, Honor Play6T, Honor X40i, vivo Y55s, 中国移动NZONE S7/NZONE 50 Pro, 中国电信麦芒11/麦芒A20, ZTE 远航30, OPPO A55s/A1x, Redmi Note 11 SE, Samsung Galaxy A23, 康佳X20, WIKO Hi畅享60s, Hi畅享70 Pro |
- Architecture
- CPU Architecture / Core design
- Clock Speed
- Base or boost processor frequency
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics / Adreno / Mali