MediaTekMobile SoC
Dimensity 700
Spec snapshot for Dimensity 700.
Ladder positions
1 placements #53 MediaTek
Specifications
1 variants| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 700 | 7 nm (TSMC N7) | 2× Cortex-A76 + 6× Cortex-A55 | 2.2 + 2.0 GHz | Mali-G57 MC2 | LPDDR4x-2133, up to capacity 12GB | Integrated 5G modem, supports NSA/SAdual-mode, 5G Dual Carrier Aggregation, 5Gdual-SIM dual-standby | 2020-11-11 | realme V11/V13/Q3i, Redmi Note 10/Redmi 11 Prime 5G, Honor X20 SE, Honor Enjoy 30 Plus, Honor Play6T, Honor X40i, vivo Y55s, China Mobile NZONE S7/NZONE 50 Pro, China Telecom Maimang 11/Maimang A20, ZTE Voyage 30, OPPO A55s/A1x, Redmi Note 11 SE, Samsung Galaxy A23, Konka X20, WIKO HiEnjoy 60s, HiEnjoy 70 Pro |
- Architecture
- CPU core layout, fastest cluster first
- Clock Speed
- Maximum clock of each cluster, in the same order
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics
Sources
2 referencesSpecifications are cross-checked against these references; conflicting values were reviewed before being corrected.