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MEDIATEK Mobile CPU
Dimensity 7050
Spec snapshot for Dimensity 7050.
Ladder positions
#24 in MediaTek
Specifications
| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 7050 | 6nm | 2x A78 + 6x A55 | 2.6 + 2.0GHz | Mali-G68 MC4 950MHz | LPDDR4X/5 | 5G | 2023 Q2 | realme 11 Pro/11 Pro + /12/12 + , OPPO A2 Pro/A3 Pro, 水月雨MIAD 01 HiFi |
- Architecture
- CPU Architecture / Core design
- Clock Speed
- Base or boost processor frequency
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics / Adreno / Mali