MediaTekMobile SoC
Dimensity 7050
Spec snapshot for Dimensity 7050.
Ladder positions
1 placements #32 MediaTek
Specifications
1 variants| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 7050 | 6 nm (TSMC N6) | 2× Cortex-A78 + 6× Cortex-A55 | 2.6 + 2.0 GHz | Mali-G68 MC4 | LPDDR4x, LPDDR5 | Integrated 5G modem, supports Sub-6GHz, SA/NSA dual-mode | 2023-01-01 | realme 11 Pro/11 Pro+/12/12+, OPPO A2 Pro/A3 Pro, Moondrop MIAD 01 HiFi |
- Architecture
- CPU core layout, fastest cluster first
- Clock Speed
- Maximum clock of each cluster, in the same order
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics
Sources
2 referencesSpecifications are cross-checked against these references; conflicting values were reviewed before being corrected.