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Mobile SoC ladder

MediaTekMobile SoC

Dimensity 7200

Spec snapshot for Dimensity 7200.

Best ladder rank
#31
Series
MediaTek
Release
2023-02-16

Ladder positions

1 placements
#31 MediaTek

Specifications

1 variants
Model Process Architecture Clock Speed GPU Memory Baseband Release Date Devices
Dimensity 7200 4 nm (TSMC N4P) 2× Cortex-A715 + 6× Cortex-A510 2.8 + 2.0 GHz Mali-G610 MC4 LPDDR4X-4266 LPDDR5-6400 Integrated Sub-6GHz 5G modem, downlink speed 4.7Gbps, supports 5G Dual Carrier Aggregation, 5Gdual-SIM dual-standby 2023-02-16 vivo V27, Redmi Note 13 Pro+, vivo S18e, Nothing Phone(2a)
Architecture
CPU core layout, fastest cluster first
Clock Speed
Maximum clock of each cluster, in the same order
Baseband
Cellular modem and capabilities
GPU
Integrated graphics

Sources

2 references

Specifications are cross-checked against these references; conflicting values were reviewed before being corrected.