MEDIATEK · Mobile SoC
Dimensity 7300
Spec snapshot for Dimensity 7300.
Ladder positions
1 placements #30 MediaTek
Specifications
1 variants| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 7300 | TSMC 4nm | 4x A78+4x A55 | 2.5+2.0GHz | Arm Mali-G615 | LPDDR4X-4266 LPDDR5-6400 | Integrated 5G modem, supports 5G UltraSave 3.0+ | 2024-05-30 | Unihertz Jelly Max, CMF Phone 1, Redmi Note 14 Pro, realme 13 Pro, OPPO A5 Pro, OPPO A6 Pro, vivo Y500, Nothing Phone(3a)Lite |
- Architecture
- CPU Architecture / Core design
- Clock Speed
- Base or boost processor frequency
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics / Adreno / Mali