MediaTekMobile SoC
Dimensity 7300
Spec snapshot for Dimensity 7300.
Ladder positions
1 placements #30 MediaTek
Specifications
1 variants| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 7300 | 4 nm (TSMC N4) | 4× Cortex-A78 + 4× Cortex-A55 | 2.5 + 2.0 GHz | Mali-G615 MC2 | LPDDR4X-4266 LPDDR5-6400 | Integrated 5G modem, supports 5G UltraSave 3.0+ | 2024-05-30 | Unihertz Jelly Max, CMF Phone 1, Redmi Note 14 Pro, realme 13 Pro, OPPO A5 Pro, OPPO A6 Pro, vivo Y500, Nothing Phone(3a)Lite |
- Architecture
- CPU core layout, fastest cluster first
- Clock Speed
- Maximum clock of each cluster, in the same order
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics
Sources
2 referencesSpecifications are cross-checked against these references; conflicting values were reviewed before being corrected.