MediaTekMobile SoC
Dimensity 8050
Spec snapshot for Dimensity 8050.
Ladder positions
1 placements #28 MediaTek
Specifications
1 variants| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 8050 | 6 nm (TSMC N6) | 1× Cortex-A78 + 3× Cortex-A78 + 4× Cortex-A55 | 3.0 + 2.6 + 2.0 GHz | Mali-G77 MC9 | Quad-channel LPDDR4x | Integrated 5G modem, supports 5Gdual-SIM | 2023-05-09 | Transsion Camon 20 Premier 5G |
- Architecture
- CPU core layout, fastest cluster first
- Clock Speed
- Maximum clock of each cluster, in the same order
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics
Sources
2 referencesSpecifications are cross-checked against these references; conflicting values were reviewed before being corrected.