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MEDIATEK Mobile CPU
Dimensity 8050
Spec snapshot for Dimensity 8050.
Ladder positions
#28 in MediaTek
Specifications
| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 8050 | TSMC 6nm | 4x A78+4x A55 | 3.0+2.0GHz | Arm Mali-G77 MC9 | Quad-channel LPDDR4x | Integrated 5G modem, supports 5Gdual-SIM | 2023-05-09 | Transsion Camon 20 Premier 5G |
- Architecture
- CPU Architecture / Core design
- Clock Speed
- Base or boost processor frequency
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics / Adreno / Mali