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Mobile SoC ladder

MediaTekMobile SoC

Dimensity 8100

Spec snapshot for Dimensity 8100.

Best ladder rank
#27
Series
MediaTek
Release
2022-03-01

Ladder positions

1 placements
#27 MediaTek

Specifications

1 variants
Model Process Architecture Clock Speed GPU Memory Baseband Release Date Devices
Dimensity 8100 5 nm (TSMC N5) 4× Cortex-A78 + 4× Cortex-A55 2.85 + 2.0 GHz Mali-G610 MC6 Quad-channel LPDDR5 Integrated R16 5G baseband 2022-03-01 Redmi K50, realme GT Neo3
Architecture
CPU core layout, fastest cluster first
Clock Speed
Maximum clock of each cluster, in the same order
Baseband
Cellular modem and capabilities
GPU
Integrated graphics

Sources

2 references

Specifications are cross-checked against these references; conflicting values were reviewed before being corrected.