MediaTekMobile SoC
Dimensity 8200
Spec snapshot for Dimensity 8200.
Ladder positions
1 placements #26 MediaTek
Specifications
1 variants| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 8200 | 4 nm (TSMC N4) | 1× Cortex-A78 + 3× Cortex-A78 + 4× Cortex-A55 | 3.1 + 3.0 + 2.0 GHz | Mali-G610 MC6 | Quad-channel LPDDR5-6400 | Integrated 5G baseband, supports Sub-6GHz all 5G network | 2022-12-08 | Redmi K60E, iQOO Neo7 SE, OPPO Reno11 |
- Architecture
- CPU core layout, fastest cluster first
- Clock Speed
- Maximum clock of each cluster, in the same order
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics
Sources
2 referencesSpecifications are cross-checked against these references; conflicting values were reviewed before being corrected.