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MEDIATEK Mobile CPU
Dimensity 8200
Spec snapshot for Dimensity 8200.
Ladder positions
#26 in MediaTek
Specifications
| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 8200 | TSMC 4nm | 1x A78+3x A78+4x A55 | 3.1+3.0+.20GHz | Mali-G610 6x | Quad-channel LPDDR5-6400 | Integrated 5G baseband, supports Sub-6GHz all 5G network | 2022-12-08 | Redmi K60E, iQOO Neo7 SE, OPPO Reno11 |
- Architecture
- CPU Architecture / Core design
- Clock Speed
- Base or boost processor frequency
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics / Adreno / Mali