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MEDIATEK Mobile CPU
Dimensity 8300
Spec snapshot for Dimensity 8300.
Ladder positions
#13 in MediaTek
Specifications
| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 8300 | 4nm | 1x A715 + 3x A715 + 4x A510 | 3.35 + 3.2 + 2.2GHz | Mali-G615 MC6 1400MHz | LPDDR5X-8533 | 5G 5.17Gbps | 2023 Q4 | Redmi K70E(Ultra), Xiaomi 14T |
- Architecture
- CPU Architecture / Core design
- Clock Speed
- Base or boost processor frequency
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics / Adreno / Mali