MediaTekMobile SoC
Dimensity 8300
Spec snapshot for Dimensity 8300.
Ladder positions
1 placements #21 MediaTek
Specifications
1 variants| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 8300 | 4 nm (TSMC N4P) | 1× Cortex-A715 + 3× Cortex-A715 + 4× Cortex-A510 | 3.35 + 3.2 + 2.2 GHz | Mali-G615 MC6 | LPDDR5X 8533Mbps, up to 24GB memory, supports UFS 4.0 storage | Integrated MediaTek T800 5G modem | 2023-11-21 | Redmi K70E |
- Architecture
- CPU core layout, fastest cluster first
- Clock Speed
- Maximum clock of each cluster, in the same order
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics
Sources
2 referencesSpecifications are cross-checked against these references; conflicting values were reviewed before being corrected.