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MEDIATEK Mobile CPU
Dimensity 8300
Spec snapshot for Dimensity 8300.
Ladder positions
#21 in MediaTek
Specifications
| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 8300 | TSMC 2nd 4nm process | 1x A715+3x A715+4x A510 | 3.35+3.2+2.2GHz | Mali-G615 MP6 | LPDDR5X 8533Mbps, up to 24GB memory, supports UFS 4.0 storage | Integrated MediaTek T800 5G modem | 2023-11-21 | Redmi K70E |
- Architecture
- CPU Architecture / Core design
- Clock Speed
- Base or boost processor frequency
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics / Adreno / Mali