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MEDIATEK Mobile CPU
Dimensity 900
Spec snapshot for Dimensity 900.
Ladder positions
#40 in MediaTek
Specifications
| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 900 | TSMC 6nm | 2x A78+6x A55 | 2.4+2.0GHz | Arm Mali-G68 MC4 | LPDDR5, UFS 3.1 | Integrated 5G modem | 2021-05-13 | OPPO Reno 6, Redmi Note 10, Honor 50 SE, Honor X20, Honor X30 Max, Honor 80 SE, iQOO Z5x, Coolpad COOL 20 Pro, Honor 60 SE, vivo Y100 |
- Architecture
- CPU Architecture / Core design
- Clock Speed
- Base or boost processor frequency
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics / Adreno / Mali