MediaTekMobile SoC
Dimensity 900
Spec snapshot for Dimensity 900.
Ladder positions
1 placements #40 MediaTek
Specifications
1 variants| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 900 | 6 nm (TSMC N6) | 2× Cortex-A78 + 6× Cortex-A55 | 2.4 + 2.0 GHz | Mali-G68 MC4 | LPDDR5, UFS 3.1 | Integrated 5G modem | 2021-05-13 | OPPO Reno 6, Redmi Note 10, Honor 50 SE, Honor X20, Honor X30 Max, Honor 80 SE, iQOO Z5x, Coolpad COOL 20 Pro, Honor 60 SE, vivo Y100 |
- Architecture
- CPU core layout, fastest cluster first
- Clock Speed
- Maximum clock of each cluster, in the same order
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics
Sources
2 referencesSpecifications are cross-checked against these references; conflicting values were reviewed before being corrected.