MediaTekMobile SoC
Dimensity 1050
Spec snapshot for Dimensity 1050.
Ladder positions
1 placements #37 MediaTek
Specifications
1 variants| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 1050 | 6 nm (TSMC N6) | 2× Cortex-A78 + 6× Cortex-A55 | 2.5 + 2.0 GHz | Mali-G610 MC3 | LPDDR5, up to 16GB | Integrated 5G modem, supports 5GmmWave and Sub-6GHz | 2022-05-23 | MT6879 |
- Architecture
- CPU core layout, fastest cluster first
- Clock Speed
- Maximum clock of each cluster, in the same order
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics
Sources
2 referencesSpecifications are cross-checked against these references; conflicting values were reviewed before being corrected.