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Mobile SoC ladder

MediaTekMobile SoC

Dimensity 820

Spec snapshot for Dimensity 820.

Best ladder rank
#46
Series
MediaTek
Release
2020-05-18

Ladder positions

1 placements
#46 MediaTek

Specifications

1 variants
Model Process Architecture Clock Speed GPU Memory Baseband Release Date Devices
Dimensity 820 7 nm (TSMC N7) 4× Cortex-A76 + 4× Cortex-A55 2.6 + 2.0 GHz Mali-G57 MC5 LPDDR4X, up to supports 16GB Integrated MediaTek 5G modem, supports NSA/SA 2020-05-18 Redmi 10X, Redmi 10X Pro
Architecture
CPU core layout, fastest cluster first
Clock Speed
Maximum clock of each cluster, in the same order
Baseband
Cellular modem and capabilities
GPU
Integrated graphics

Sources

2 references

Specifications are cross-checked against these references; conflicting values were reviewed before being corrected.