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Mobile SoC ladder

MediaTekMobile SoC

Dimensity 9500

Spec snapshot for Dimensity 9500.

Best ladder rank
#4
Series
MediaTek
Release
2025-09-22

Ladder positions

1 placements
#4 MediaTek

Specifications

1 variants
Model Process Architecture Clock Speed GPU Memory Baseband Release Date Devices
Dimensity 9500 3 nm (TSMC N3P) 1× C1-Ultra + 3× C1-Premium + 4× C1-Pro 4.21 + 3.5 + 2.7 GHz Mali G1-Ultra MC12 LPDDR5X Integrated 5G modem 2025-09-22 -
Architecture
CPU core layout, fastest cluster first
Clock Speed
Maximum clock of each cluster, in the same order
Baseband
Cellular modem and capabilities
GPU
Integrated graphics

Sources

2 references

Specifications are cross-checked against these references; conflicting values were reviewed before being corrected.