MediaTekMobile SoC
Dimensity 8400
Spec snapshot for Dimensity 8400.
Ladder positions
1 placements #17 MediaTek
Specifications
1 variants| Model | Process | Architecture | Clock Speed | GPU | Memory | Baseband | Release Date | Devices |
|---|---|---|---|---|---|---|---|---|
| Dimensity 8400 | 4 nm (TSMC N4P) | 1× Cortex-A725 + 3× Cortex-A725 + 4× Cortex-A725 | 3.25 + 3.0 + 2.1 GHz | Mali-G720 MC7 | LPDDR5X-8533 | 5G-Amodem | 2024-12-23 | Redmi Turbo 4 |
- Architecture
- CPU core layout, fastest cluster first
- Clock Speed
- Maximum clock of each cluster, in the same order
- Baseband
- Cellular modem and capabilities
- GPU
- Integrated graphics
Sources
2 referencesSpecifications are cross-checked against these references; conflicting values were reviewed before being corrected.