Skip to content
Mobile SoC ladder

MediaTekMobile SoC

Dimensity 9200+

Spec snapshot for Dimensity 9200+.

Best ladder rank
#18
Series
MediaTek
Release
2023-05-10

Ladder positions

1 placements
#18 MediaTek

Specifications

1 variants
Model Process Architecture Clock Speed GPU Memory Baseband Release Date Devices
Dimensity 9200+ 4 nm (TSMC N4P) 1× Cortex-X3 + 3× Cortex-A715 + 4× Cortex-A510 3.35 + 3.0 + 2.0 GHz Immortalis-G715 MC11 LPDDR5X-8533 Integrated 5G R16modem 2023-05-10 iQOO Neo8 Pro, vivo X90s, Redmi K60Ultra Edition, Xiaomi 13T Pro, vivo S18 Pro, vivo S19 Pro, OPPO Reno12 Pro
Architecture
CPU core layout, fastest cluster first
Clock Speed
Maximum clock of each cluster, in the same order
Baseband
Cellular modem and capabilities
GPU
Integrated graphics

Sources

2 references

Specifications are cross-checked against these references; conflicting values were reviewed before being corrected.